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A groundbreaking technological shift is quietly transforming the landscape of surface engineering. High-energy pulse Physical Vapor Deposition (PVD) technology, once a specialized laboratory technique, is now emerging as the frontier of next-generation vacuum coating, promising to redefine performance standards across semiconductors, 3C products, and new energy sectors.
At the recent 2024 Greater Bay Area High-Energy Pulse PVD Summit in Dongguan, experts gathered to dissect this revolutionary technology. Professor Tian Xiubo, forum convener and plasma team leader at the Songshan Lake Materials Laboratory, illuminated its core principle: "High-energy pulse PVD leverages high-density plasma discharge to generate comprehensive effects of ions and electrons, effectively enhancing coating adhesion, film densification, and uniformity" .
This fundamental advancement addresses chronic industry pain points, positioning pulse technology as the inevitable successor to conventional PVD methods. Unlike traditional approaches, high-energy pulse techniques—including high-energy pulse magnetron sputtering and pulse arc deposition—create superior plasma conditions that result in coatings with exceptional structural integrity and performance characteristics .
The transition to pulse technology is catalyzing remarkable innovations in Coating Equipment. Advanced systems like the GD Large Multiarc Ion Sputtering Machine and TG Multiarc Ion Sputtering Machine now incorporate pulse power supplies and precision control systems that optimize deposition parameters in real-time .
Modern PVD Multiarc Ion Sputtering Coating Machine configurations represent a quantum leap in capability. These systems feature enhanced filtration technologies that effectively reduce coating macroparticles while maintaining plasma stability . The latest Coating Equipment integrates dual magnetic field enhancement and optimized pulse bias application, achieving unprecedented levels of coating precision and operational efficiency .
The practical implementation of this technology is already yielding substantial benefits across multiple sectors. In semiconductor manufacturing, high-energy pulse PVD enables the production of sophisticated films for semiconductor TGV and flexible circuit boards . The technology's capacity for depositing micro-level plasma-resistant coatings (>30 μm) makes it invaluable for advanced semiconductor processes .
Beyond electronics, the technology demonstrates remarkable versatility. Tool coatings deposited via pulse techniques significantly enhance surface hardness and lubricity, dramatically extending the service life of cutting tools and forming dies . Similarly, the decorative coating sector benefits from the superior quality and durability offered by pulse-based deposition methods .
As industries increasingly demand higher performance coatings, the transition to high-energy pulse PVD appears inevitable. Research institutions and enterprises are actively collaborating to establish a comprehensive ecosystem that bridges technical innovation with industrial application .
With its capacity to drive manufacturing upgrades across multiple strategic industries, high-energy pulse PVD stands poised to become the new benchmark for vacuum coating technology. As Professor Tian emphasized, proactive layout and intensified industry-academia-research application platforms will be crucial to fully harness its potential .
The pulse revolution has arrived—and it's charging the future of surface engineering.

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